CY7C1263V18-400BZXC

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory device
• Characteristics: High-speed, low-power, synchronous SRAM
• Package: BGA (Ball Grid Array)
• Essence: A high-performance memory chip designed for various applications
• Packaging/Quantity: Available in tape and reel packaging, quantity depends on customer requirements

Specifications

• Model: CY7C1263V18-400BZXC
• Memory Type: Synchronous SRAM
• Organization: 1M x 18
• Speed: 400 MHz
• Voltage: 1.8V
• Access Time: 2.5 ns
• Operating Temperature Range: -40°C to +85°C
• RoHS Compliance: Yes

Detailed Pin Configuration

The CY7C1263V18-400BZXC has a total of 119 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDDQ | Power supply for I/O buffers | | 2 | DQ0 | Data Input/Output Bit 0 | | 3 | DQ1 | Data Input/Output Bit 1 | | ... | ... | ... | | 118 | VSSQ | Ground for I/O buffers | | 119 | VDD | Power supply for core logic |

Functional Features

• High-speed operation: The CY7C1263V18-400BZXC offers fast access times, making it suitable for applications requiring quick data retrieval.
• Low power consumption: It is designed to operate at low voltage, reducing power consumption and extending battery life in portable devices.
• Synchronous interface: The chip synchronizes data transfers with the system clock, ensuring reliable and efficient communication.
• Easy integration: The BGA package allows for compact and space-saving designs, making it suitable for small form factor devices.

Advantages and Disadvantages

Advantages: - High-speed operation enables fast data access. - Low power consumption extends battery life. - Synchronous interface ensures reliable communication. - Compact BGA package allows for space-saving designs.

Disadvantages: - Limited storage capacity compared to other memory technologies. - Higher cost per bit compared to some alternative memory solutions.

Working Principles

The CY7C1263V18-400BZXC operates based on synchronous static random-access memory (SRAM) technology. It stores data in a volatile manner, meaning that the data is lost when power is removed. The chip uses a synchronous interface to communicate with the system, allowing for efficient data transfer and synchronization with the system clock.

Detailed Application Field Plans

The CY7C1263V18-400BZXC can be used in various applications, including but not limited to: 1. Networking equipment: Routers, switches, and network cards benefit from the high-speed and low-power characteristics of this memory chip. 2. Telecommunications systems: The chip's fast access times make it suitable for buffering and storing data in telecommunications infrastructure. 3. Industrial automation: Control systems and data acquisition devices can utilize the high-performance capabilities of the CY7C1263V18-400BZXC. 4. Consumer electronics: Portable devices such as smartphones, tablets, and gaming consoles can benefit from the low power consumption and compact package of this memory chip.

Detailed and Complete Alternative Models

1. CY7C1263SV18-400BZXC: Similar to the CY7C1263V18-400BZXC, but operates at a lower voltage of 1.5V.
2. CY7C1263V18-400BZXC-10: A variant with extended temperature range (-40°C to +105°C) for industrial applications.
3. CY7C1263V18-400BZXI: Same specifications as CY7C1263V18-400BZXC, but available in an LFBGA (Low Profile Fine-Pitch Ball Grid Array) package.

These alternative models offer similar functionality and performance, providing options based on specific application requirements.

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