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CY7C1460AV25-200BZXC

CY7C1460AV25-200BZXC

Product Overview

Category

The CY7C1460AV25-200BZXC belongs to the category of high-performance synchronous SRAM (Static Random Access Memory) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices, such as computers, networking equipment, telecommunications systems, and embedded systems.

Characteristics

  • High Performance: The CY7C1460AV25-200BZXC offers fast access times and high-speed data transfer rates, making it suitable for demanding applications.
  • Large Storage Capacity: This chip provides a significant amount of memory, allowing for the storage of large amounts of data.
  • Low Power Consumption: Despite its high performance, the CY7C1460AV25-200BZXC is designed to consume minimal power, making it energy-efficient.
  • Robust Design: It features a sturdy construction that ensures durability and reliability even in harsh operating conditions.

Package and Quantity

The CY7C1460AV25-200BZXC is available in a compact and standardized package, typically a surface-mount technology (SMT) package. The exact package type may vary depending on the manufacturer. It is usually supplied in reels or trays, with quantities ranging from hundreds to thousands per package.

Specifications

  • Part Number: CY7C1460AV25-200BZXC
  • Memory Type: Synchronous SRAM
  • Organization: 1M x 16 bits
  • Operating Voltage: 2.5V
  • Access Time: 200 ns
  • Interface: Parallel
  • Package Type: Surface Mount Technology (SMT)
  • Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The CY7C1460AV25-200BZXC has a 48-pin package with the following pin configuration:

  1. VDD
  2. A0
  3. A1
  4. A2
  5. A3
  6. A4
  7. A5
  8. A6
  9. A7
  10. A8
  11. A9
  12. A10
  13. A11
  14. A12
  15. A13
  16. A14
  17. A15
  18. DQ0
  19. DQ1
  20. DQ2
  21. DQ3
  22. DQ4
  23. DQ5
  24. DQ6
  25. DQ7
  26. DQ8
  27. DQ9
  28. DQ10
  29. DQ11
  30. DQ12
  31. DQ13
  32. DQ14
  33. DQ15
  34. /WE (Write Enable)
  35. /OE (Output Enable)
  36. /CE (Chip Enable)
  37. /UB (Upper Byte)
  38. /LB (Lower Byte)
  39. CLK (Clock)
  40. /BYTE (Byte Mode Select)
  41. /ZZ (Power Down)
  42. VSS
  43. VSS
  44. VSS
  45. VSS
  46. VSS
  47. VSS
  48. VDDQ

Functional Features

  • High-Speed Operation: The CY7C1460AV25-200BZXC offers fast access times, allowing for quick data retrieval and storage.
  • Asynchronous and Synchronous Modes: It supports both asynchronous and synchronous operation modes, providing flexibility in different system configurations.
  • Burst Mode Support: This chip includes burst mode functionality, enabling efficient consecutive data transfers.
  • Easy Integration: The CY7C1460AV25-200BZXC can be easily integrated into various electronic systems due to its standard interface and pin compatibility.

Advantages and Disadvantages

Advantages

  • High performance and fast access times.
  • Large storage capacity for data-intensive applications.
  • Low power consumption, contributing to energy efficiency.
  • Robust design ensures reliability in demanding environments.
  • Easy integration into different system configurations.

Disadvantages

  • Limited temperature range (-40°C to +85°C) may not be suitable for extreme temperature applications.
  • Availability and pricing may vary depending on the manufacturer and market demand.

Working Principles

The CY7C1460AV25-200BZXC operates based on the principles of synchronous SRAM. It utilizes a clock signal (CLK) to synchronize data transfers between the memory and the external system. The chip's internal circuitry allows for efficient reading and writing of data, ensuring reliable and high-speed operation.

Detailed Application Field Plans

The CY7C1460AV25-200BZXC finds extensive use in various applications, including:

  1. Computer Systems: Used as cache memory or main memory in desktops, laptops,

Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de CY7C1460AV25-200BZXC en soluciones técnicas

Sure! Here are 10 common questions and answers related to the application of CY7C1460AV25-200BZXC in technical solutions:

  1. Question: What is the maximum operating frequency of CY7C1460AV25-200BZXC?
    Answer: The maximum operating frequency of CY7C1460AV25-200BZXC is 200 MHz.

  2. Question: What is the voltage supply range for CY7C1460AV25-200BZXC?
    Answer: CY7C1460AV25-200BZXC operates with a voltage supply range of 3.3V ± 5%.

  3. Question: How much memory does CY7C1460AV25-200BZXC have?
    Answer: CY7C1460AV25-200BZXC has a memory capacity of 4 Megabits (512K x 8).

  4. Question: What is the access time of CY7C1460AV25-200BZXC?
    Answer: The access time of CY7C1460AV25-200BZXC is 20 ns.

  5. Question: Can CY7C1460AV25-200BZXC be used in automotive applications?
    Answer: Yes, CY7C1460AV25-200BZXC is suitable for automotive applications as it meets the AEC-Q100 Grade 2 qualification.

  6. Question: Does CY7C1460AV25-200BZXC support industrial temperature range?
    Answer: Yes, CY7C1460AV25-200BZXC supports an industrial temperature range of -40°C to +85°C.

  7. Question: What is the package type of CY7C1460AV25-200BZXC?
    Answer: CY7C1460AV25-200BZXC is available in a 48-pin TSOP-II package.

  8. Question: Can CY7C1460AV25-200BZXC operate at lower voltages?
    Answer: Yes, CY7C1460AV25-200BZXC can operate at lower voltages by using an external voltage regulator.

  9. Question: Does CY7C1460AV25-200BZXC support burst mode operation?
    Answer: Yes, CY7C1460AV25-200BZXC supports burst mode operation for efficient data transfer.

  10. Question: Is CY7C1460AV25-200BZXC compatible with other memory devices?
    Answer: Yes, CY7C1460AV25-200BZXC is compatible with other standard asynchronous SRAM devices and can be used as a drop-in replacement.

Please note that these answers are based on general information about CY7C1460AV25-200BZXC and may vary depending on specific application requirements. It's always recommended to refer to the datasheet and consult with the manufacturer for detailed technical specifications and application-specific questions.