S70FL01GSAGBHBC13

Basic Information Overview

• Category: Flash Memory
• Use: Data storage and retrieval in electronic devices
• Characteristics:
  • Non-volatile memory
  • High-speed read and write operations
  • Low power consumption
  • Large storage capacity
• Package: BGA (Ball Grid Array)
• Essence: Provides reliable and efficient data storage solution for various electronic devices
• Packaging/Quantity: Single unit packaging

Specifications

• Model: S70FL01GSAGBHBC13
• Capacity: 1 Gigabit (128 Megabytes)
• Interface: Serial Peripheral Interface (SPI)
• Voltage Range: 2.7V to 3.6V
• Operating Temperature: -40°C to +85°C
• Erase/Program Cycles: 100,000 cycles (typical)

Detailed Pin Configuration

The S70FL01GSAGBHBC13 flash memory module has the following pin configuration:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VCC | Power Supply | | 2 | GND | Ground | | 3 | HOLD | Hold Input | | 4 | WP | Write Protect Input | | 5 | SIO0 | Serial Data Input/Output 0 | | 6 | SIO1 | Serial Data Input/Output 1 | | 7 | SIO2 | Serial Data Input/Output 2 | | 8 | SIO3 | Serial Data Input/Output 3 | | 9 | SCK | Serial Clock Input | | 10 | CE# | Chip Enable Input | | 11 | RESET# | Reset Input |

Functional Features

• High-speed data transfer rate
• Flexible erase and program operations
• Sector-based erasure for efficient memory management
• Hardware and software protection mechanisms
• Reliable data retention even in harsh environments

Advantages and Disadvantages

Advantages

• Fast read and write operations
• Low power consumption
• Large storage capacity
• Compact BGA package for space-constrained designs
• High endurance with 100,000 erase/program cycles

Disadvantages

• Relatively higher cost compared to other memory technologies
• Limited compatibility with certain legacy systems

Working Principles

The S70FL01GSAGBHBC13 flash memory utilizes the Serial Peripheral Interface (SPI) to communicate with the host device. It stores data in non-volatile memory cells that can be electrically erased and programmed. The memory is organized into sectors, allowing for efficient erasure and programming of specific data regions. The SPI interface enables high-speed data transfer between the flash memory and the host device.

Detailed Application Field Plans

The S70FL01GSAGBHBC13 flash memory module finds applications in various electronic devices, including: 1. Smartphones and tablets 2. Solid-state drives (SSDs) 3. Digital cameras 4. Automotive electronics 5. Industrial control systems

Detailed and Complete Alternative Models

1. S25FL128SAGMFI001 - 128 Megabit (16 Megabyte) flash memory with similar characteristics and package.
2. MX25L12835FM2I-10G - 128 Megabit (16 Megabyte) flash memory with SPI interface and comparable specifications.
3. W25Q128JVSIQ - 128 Megabit (16 Megabyte) flash memory with SPI interface and extended temperature range.

(Note: These alternative models are provided as examples and may not cover all available options.)

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