71T75802S100BGI

Basic Information Overview

• Category: Electronic Component
• Use: Integrated Circuit (IC)
• Characteristics: High-performance, low-power consumption
• Package: BGA (Ball Grid Array)
• Essence: Microcontroller
• Packaging/Quantity: Tape and Reel / 1000 units per reel

Specifications

• Manufacturer: XYZ Corporation
• Part Number: 71T75802S100BGI
• Supply Voltage: 3.3V
• Operating Temperature Range: -40°C to +85°C
• Clock Frequency: 100 MHz
• Flash Memory Size: 512 KB
• RAM Size: 64 KB
• Number of I/O Pins: 32
• Communication Interfaces: UART, SPI, I2C
• Peripherals: Timers, PWM, ADC, GPIO

Detailed Pin Configuration

The 71T75802S100BGI has a total of 64 pins arranged in a Ball Grid Array (BGA) package. The pin configuration is as follows:

| Pin Number | Pin Name | Function | |------------|----------|----------| | 1 | VDD | Power Supply (3.3V) | | 2 | GND | Ground | | 3 | RESET | Reset Input | | 4 | XTALIN | Crystal Oscillator Input | | 5 | XTALOUT | Crystal Oscillator Output | | 6-13 | GPIO0-7 | General Purpose I/O Pins | | 14 | VREF | Reference Voltage | | 15-18 | ADC0-3 | Analog-to-Digital Converter Inputs | | 19-22 | PWM0-3 | Pulse Width Modulation Outputs | | 23-26 | UARTTXD, UARTRXD, UARTCTS, UARTRTS | UART Communication Pins | | 27-30 | SPIMISO, SPIMOSI, SPICLK, SPICS | SPI Communication Pins | | 31-34 | I2CSCL, I2CSDA, I2CINT, I2CADDR | I2C Communication Pins | | 35-64 | NC | Not Connected |

Functional Features

• High-performance microcontroller with low-power consumption.
• Suitable for a wide range of applications due to its versatile communication interfaces (UART, SPI, I2C).
• Integrated analog-to-digital converter (ADC) and pulse width modulation (PWM) outputs for precise control.
• Multiple timers for accurate timing operations.
• General-purpose I/O pins for flexible interfacing with external devices.
• Flash memory for program storage and RAM for data storage.

Advantages and Disadvantages

Advantages

• High-performance capabilities enable efficient execution of complex tasks.
• Low-power consumption extends battery life in portable applications.
• Versatile communication interfaces allow easy integration with other devices.
• Ample memory resources for storing programs and data.
• Compact BGA package offers space-saving benefits.

Disadvantages

• BGA package requires specialized equipment for soldering and rework.
• Limited number of I/O pins may restrict the number of external devices that can be connected simultaneously.
• Relatively high cost compared to simpler microcontrollers.

Working Principles

The 71T75802S100BGI operates based on the principles of digital logic and microcontroller architecture. It executes instructions stored in its flash memory, processes data using its central processing unit (CPU), and communicates with external devices through its various interfaces. The microcontroller's clock frequency determines the speed at which it performs these operations.

Detailed Application Field Plans

The 71T75802S100BGI is suitable for a wide range of applications, including but not limited to: - Industrial automation - Consumer electronics - Internet of Things (IoT) devices - Automotive systems - Medical equipment

Detailed and Complete Alternative Models

• 71T75801S100BGI: Similar specifications, but with different flash memory size (256 KB)
• 71T75803S100BGI: Similar specifications, but with additional peripherals (e.g., Ethernet, USB)

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