DSPIC33FJ12MC202-E/SP

Product Overview

• Category: Microcontroller
• Use: Embedded systems, control applications
• Characteristics: High-performance, low-power consumption
• Package: 28-pin SPDIP (Shrink Plastic Dual Inline Package)
• Essence: Digital Signal Controller (DSC) with enhanced features
• Packaging/Quantity: Single unit

Specifications

• Architecture: Modified Harvard architecture
• CPU Speed: Up to 40 MIPS (Million Instructions per Second)
• Program Memory Size: 12 KB Flash
• Data Memory Size: 256 bytes RAM
• Operating Voltage Range: 2.5V to 5.5V
• I/O Pins: 22
• Analog Inputs: 6
• Timers: 3
• Communication Interfaces: UART, SPI, I2C
• ADC Resolution: 10-bit
• PWM Channels: 4
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The DSPIC33FJ12MC202-E/SP has a total of 28 pins. The pin configuration is as follows:

1. VDD - Power supply voltage
2. VSS - Ground
3. AN0 - Analog input channel 0
4. AN1 - Analog input channel 1
5. AN2 - Analog input channel 2
6. AN3 - Analog input channel 3
7. AN4 - Analog input channel 4
8. AN5 - Analog input channel 5
9. RA0/AN0 - General-purpose I/O or analog input
10. RA1/AN1 - General-purpose I/O or analog input
11. RA2/AN2 - General-purpose I/O or analog input
12. RA3/AN3 - General-purpose I/O or analog input
13. RA4/AN4 - General-purpose I/O or analog input
14. RA5/AN5 - General-purpose I/O or analog input
15. RB0 - General-purpose I/O
16. RB1 - General-purpose I/O
17. RB2 - General-purpose I/O
18. RB3 - General-purpose I/O
19. RB4 - General-purpose I/O
20. RB5 - General-purpose I/O
21. RB6 - General-purpose I/O
22. RB7 - General-purpose I/O
23. RB8 - General-purpose I/O
24. RB9 - General-purpose I/O
25. RB10 - General-purpose I/O
26. RB11 - General-purpose I/O
27. RB12 - General-purpose I/O
28. RB13 - General-purpose I/O

Functional Features

• High-performance digital signal processing capabilities
• Enhanced control features for embedded systems
• Low-power consumption for energy-efficient applications
• Wide operating voltage range for flexibility in power supply
• Multiple communication interfaces for connectivity options
• Integrated analog-to-digital converter for sensor interfacing
• PWM channels for precise control of motors and actuators

Advantages and Disadvantages

Advantages: - High-performance processing capabilities - Low-power consumption for energy efficiency - Enhanced control features for embedded systems - Wide operating voltage range for flexibility - Multiple communication interfaces for connectivity options

Disadvantages: - Limited program memory size (12 KB Flash) - Limited data memory size (256 bytes RAM) - Limited number of I/O pins (22)

Working Principles

The DSPIC33FJ12MC202-E/SP operates on a modified Harvard architecture, combining the benefits of both Harvard and Von Neumann architectures. It has a high-performance CPU that can execute up to 40 million instructions per second (MIPS). The microcontroller utilizes its program memory (Flash) and data memory (RAM) to store and process instructions and data.

The device can interface with various peripherals and sensors through its I/O pins, analog inputs, and communication interfaces such as UART, SPI, and I2C. It also features a built-in analog-to-digital converter (ADC) for precise measurement of analog signals.

Detailed Application Field Plans

The DSPIC33FJ12MC202-E/SP is suitable for a wide range of applications, including but not limited to:

1. Industrial control systems
2. Motor control applications
3. Power management systems
4. Home automation
5. Medical devices
6. Automotive electronics
7. Robotics
8. Internet of Things (IoT) devices

Its high-performance processing capabilities, low-power consumption, and integrated peripherals make it ideal for controlling and monitoring various systems in these application fields.

Detailed and Complete Alternative Models

• DSPIC33FJ12MC202-I/SP: Same specifications and features, but in an industrial temperature range (-40°C to +125°C).
• DSPIC33FJ12MC202-E/S