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MT29F128G08CBCCBH6-6C:C
Basic Information Overview
- Category: Memory chip
- Use: Data storage in electronic devices
- Characteristics:
- Non-volatile memory
- High capacity (128GB)
- NAND Flash technology
- Package: BGA (Ball Grid Array)
- Essence: Reliable and high-performance data storage solution
- Packaging/Quantity: Individually packaged, quantity varies based on customer requirements
Specifications
- Model: MT29F128G08CBCCBH6-6C:C
- Capacity: 128GB
- Interface: NAND Flash
- Voltage: 3.3V
- Speed: Up to 200MB/s (read), up to 100MB/s (write)
- Operating Temperature: -40°C to +85°C
- Endurance: Up to 10,000 program/erase cycles
Detailed Pin Configuration
The MT29F128G08CBCCBH6-6C:C chip has a total of 48 pins. The pin configuration is as follows:
- VCC
- VCCQ
- GND
- RE#
- WE#
- CLE
- ALE
- CE#
- R/B#
- WP#
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
- NC
Functional Features
- High-speed data transfer
- Reliable and durable storage solution
- Low power consumption
- Error correction capabilities
- Wear-leveling algorithm for extended lifespan
Advantages
- Large storage capacity
- Fast read and write speeds
- Suitable for various electronic devices
- High endurance for frequent data read/write operations
- Compact BGA package for space-constrained designs
Disadvantages
- Relatively higher cost compared to lower capacity memory chips
- Limited compatibility with older devices lacking NAND Flash support
Working Principles
The MT29F128G08CBCCBH6-6C:C chip utilizes NAND Flash technology to store data. It consists of multiple memory cells organized in a grid-like structure. Each cell can store multiple bits of information by varying the charge level on the floating gate. When data is written, the charge level is adjusted, and when data is read, the charge level is measured to determine the stored value.
Detailed Application Field Plans
The MT29F128G08CBCCBH6-6C:C chip finds applications in various electronic devices that require high-capacity and reliable data storage. Some potential application fields include: - Smartphones and tablets - Solid-state drives (SSDs) - Digital cameras - Gaming consoles - Industrial control systems
Detailed and Complete Alternative Models
- MT29F128G08CBCCBH6-6C:B
- MT29F128G08CBCCBH6-6C:A
- MT29F128G08CBCCBH6-6C:D
- MT29F128G08CBCCBH6-6C:E
These alternative models offer similar specifications and functionality, providing flexibility for different design requirements.
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Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de MT29F128G08CBCCBH6-6C:C en soluciones técnicas
Question: What is the capacity of the MT29F128G08CBCCBH6-6C:C?
Answer: The MT29F128G08CBCCBH6-6C:C has a capacity of 128 gigabits (16 gigabytes).Question: What is the interface used by the MT29F128G08CBCCBH6-6C:C?
Answer: The MT29F128G08CBCCBH6-6C:C uses a NAND Flash interface.Question: What is the operating voltage range for the MT29F128G08CBCCBH6-6C:C?
Answer: The MT29F128G08CBCCBH6-6C:C operates at a voltage range of 2.7V to 3.6V.Question: What is the maximum data transfer rate supported by the MT29F128G08CBCCBH6-6C:C?
Answer: The MT29F128G08CBCCBH6-6C:C supports a maximum data transfer rate of 166 megabytes per second.Question: Does the MT29F128G08CBCCBH6-6C:C support wear-leveling and error correction?
Answer: Yes, the MT29F128G08CBCCBH6-6C:C supports both wear-leveling and error correction mechanisms.Question: Can the MT29F128G08CBCCBH6-6C:C be used in industrial temperature environments?
Answer: Yes, the MT29F128G08CBCCBH6-6C:C is designed to operate in industrial temperature ranges (-40°C to +85°C).Question: What is the typical program/erase cycle endurance of the MT29F128G08CBCCBH6-6C:C?
Answer: The MT29F128G08CBCCBH6-6C:C has a typical program/erase cycle endurance of 10,000 cycles.Question: Does the MT29F128G08CBCCBH6-6C:C support hardware encryption?
Answer: No, the MT29F128G08CBCCBH6-6C:C does not have built-in hardware encryption capabilities.Question: Can the MT29F128G08CBCCBH6-6C:C be used as a boot device?
Answer: Yes, the MT29F128G08CBCCBH6-6C:C can be used as a boot device in various applications.Question: What is the package type of the MT29F128G08CBCCBH6-6C:C?
Answer: The MT29F128G08CBCCBH6-6C:C comes in a BGA (Ball Grid Array) package.