Micron Technology Inc.
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MT29F256G08EBHAFB16A3WSA

MT29F256G08EBHAFB16A3WSA

Basic Information Overview

  • Category: Memory chip
  • Use: Data storage in electronic devices
  • Characteristics:
    • High capacity (256GB)
    • NAND flash technology
    • Synchronous interface
  • Package: BGA (Ball Grid Array)
  • Essence: Non-volatile memory for long-term data retention
  • Packaging/Quantity: Single chip

Specifications

  • Capacity: 256GB
  • Interface: Synchronous
  • Technology: NAND flash
  • Organization: 8Gb x 32
  • Voltage: 3.3V
  • Speed: Up to 200MHz
  • Operating Temperature: -40°C to +85°C
  • Package Type: 63-ball BGA

Detailed Pin Configuration

The MT29F256G08EBHAFB16A3WSA has a total of 63 pins arranged in a ball grid array configuration. The pinout is as follows:

  1. VCCQ
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSSQ
  11. WE#
  12. RE#
  13. CLE
  14. ALE
  15. CE#
  16. R/B#
  17. WP#
  18. VCC
  19. NC
  20. NC
  21. NC
  22. NC
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  63. VSS

Functional Features

  • High-speed data transfer
  • Reliable and durable NAND flash technology
  • Synchronous interface for efficient communication
  • Error correction and wear-leveling algorithms for enhanced reliability
  • Power-saving features for extended battery life

Advantages

  • Large storage capacity
  • Fast data transfer rates
  • Low power consumption
  • Compact package size
  • High reliability and durability

Disadvantages

  • Relatively high cost compared to lower-capacity memory chips
  • Limited compatibility with certain devices due to specific pin configuration

Working Principles

The MT29F256G08EBHAFB16A3WSA utilizes NAND flash technology to store data. It operates by storing electrical charges in memory cells, which can be read or written using a synchronous interface. The chip employs error correction and wear-leveling algorithms to ensure data integrity and prolong its lifespan.

Detailed Application Field Plans

The MT29F256G08EBHAFB16A3WSA is commonly used in various electronic devices that require large data storage, such as: - Solid-state drives (SSDs) - Portable media players - Digital cameras - Smartphones - Tablets

Detailed and Complete Alternative Models

  1. MT29F256G08EBHAFB16A3WSA-IT: Industrial temperature range variant
  2. MT29F256G08EBHAFB16A3WSA-TR: Tape and reel packaging option
  3. MT29F256G08EBHAFB16A3WSA-AB: Automotive temperature range variant

These alternative models offer similar specifications and functionality to the MT29F256G08EBHAFB16A3WSA, but may have slight variations in operating temperature range or packaging options.

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Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de MT29F256G08EBHAFB16A3WSA en soluciones técnicas

  1. Question: What is the capacity of the MT29F256G08EBHAFB16A3WSA memory chip?
    Answer: The MT29F256G08EBHAFB16A3WSA has a capacity of 256 gigabits (32 gigabytes).

  2. Question: What is the interface used by the MT29F256G08EBHAFB16A3WSA?
    Answer: The MT29F256G08EBHAFB16A3WSA uses a NAND Flash interface.

  3. Question: What is the operating voltage range for the MT29F256G08EBHAFB16A3WSA?
    Answer: The MT29F256G08EBHAFB16A3WSA operates at a voltage range of 2.7V to 3.6V.

  4. Question: What is the maximum data transfer rate supported by the MT29F256G08EBHAFB16A3WSA?
    Answer: The MT29F256G08EBHAFB16A3WSA supports a maximum data transfer rate of up to 200 megabytes per second.

  5. Question: Can the MT29F256G08EBHAFB16A3WSA be used in automotive applications?
    Answer: Yes, the MT29F256G08EBHAFB16A3WSA is designed for automotive-grade applications and can withstand harsh environmental conditions.

  6. Question: Does the MT29F256G08EBHAFB16A3WSA support hardware encryption?
    Answer: No, the MT29F256G08EBHAFB16A3WSA does not have built-in hardware encryption capabilities.

  7. Question: What is the endurance rating of the MT29F256G08EBHAFB16A3WSA?
    Answer: The MT29F256G08EBHAFB16A3WSA has an endurance rating of up to 100,000 program/erase cycles.

  8. Question: Can the MT29F256G08EBHAFB16A3WSA be used as a boot device?
    Answer: Yes, the MT29F256G08EBHAFB16A3WSA can be used as a boot device in various embedded systems.

  9. Question: Does the MT29F256G08EBHAFB16A3WSA support error correction codes (ECC)?
    Answer: Yes, the MT29F256G08EBHAFB16A3WSA supports hardware ECC to ensure data integrity.

  10. Question: What is the temperature range for the MT29F256G08EBHAFB16A3WSA?
    Answer: The MT29F256G08EBHAFB16A3WSA operates within a temperature range of -40°C to +85°C.