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LE25CB643TT-TLM-E

LE25CB643TT-TLM-E

Product Overview

Category: Integrated Circuit (IC)

Use: The LE25CB643TT-TLM-E is a high-performance flash memory IC designed for various electronic devices and systems. It provides non-volatile storage capabilities, allowing data to be stored even when power is removed.

Characteristics: - High-speed read and write operations - Low power consumption - Wide operating voltage range - Compact size - Durable and reliable

Package: The LE25CB643TT-TLM-E is available in a small form factor package, making it suitable for space-constrained applications. It is commonly found in surface mount technology (SMT) packages.

Essence: The essence of the LE25CB643TT-TLM-E lies in its ability to store and retrieve data reliably, providing a crucial component for electronic devices that require non-volatile memory.

Packaging/Quantity: The LE25CB643TT-TLM-E is typically packaged in reels or trays, with a quantity of 2500 units per reel/tray.

Specifications

  • Memory Type: Flash
  • Memory Size: 64 Megabits (8 Megabytes)
  • Interface: Serial Peripheral Interface (SPI)
  • Operating Voltage: 2.7V - 3.6V
  • Operating Temperature Range: -40°C to +85°C
  • Data Retention: Up to 20 years
  • Endurance: Up to 100,000 write cycles

Detailed Pin Configuration

The LE25CB643TT-TLM-E features a standard pin configuration for SPI flash memory ICs:

  1. Chip Select (/CS)
  2. Serial Clock (SCLK)
  3. Serial Data Input (SI/MOSI)
  4. Serial Data Output (SO/MISO)
  5. Write Protect (/WP)
  6. Hold (/HOLD)
  7. Ground (GND)
  8. Power Supply (VCC)

Functional Features

  • High-speed data transfer: The LE25CB643TT-TLM-E supports fast read and write operations, enabling efficient data handling in electronic systems.
  • Low power consumption: With its optimized design, the IC minimizes power usage, making it suitable for battery-powered devices.
  • Wide operating voltage range: The IC can operate within a broad voltage range, providing flexibility in various applications.
  • Durable and reliable: The flash memory technology used in the LE25CB643TT-TLM-E ensures long-term data retention and high endurance.

Advantages and Disadvantages

Advantages: - High-speed performance - Low power consumption - Compact size - Wide operating voltage range - Durable and reliable

Disadvantages: - Limited storage capacity compared to higher-density flash memory ICs - Relatively higher cost per unit compared to lower-capacity alternatives

Working Principles

The LE25CB643TT-TLM-E utilizes the Serial Peripheral Interface (SPI) protocol to communicate with the host system. It stores data in non-volatile memory cells using flash memory technology. When data is read or written, the IC transfers information through the SPI interface, allowing seamless integration into various electronic systems.

Detailed Application Field Plans

The LE25CB643TT-TLM-E finds applications in a wide range of electronic devices and systems, including but not limited to: - Consumer electronics (e.g., smartphones, tablets, digital cameras) - Automotive electronics (e.g., infotainment systems, instrument clusters) - Industrial equipment (e.g., control systems, data loggers) - Medical devices (e.g., patient monitoring systems, diagnostic equipment) - Communication devices (e.g., routers, modems)

Detailed and Complete Alternative Models

  1. LE25CB128TT-TLM-E: 128 Megabit (16 Megabyte) flash memory IC with similar characteristics and package.
  2. LE25CB256TT-TLM-E: 256 Megabit (32 Megabyte) flash memory IC with similar characteristics and package.
  3. LE25CB512TT-TLM-E: 512 Megabit (64 Megabyte) flash memory IC with similar characteristics and package.

These alternative models offer increased storage capacity while maintaining the essential features and compatibility of the LE25CB643TT-TLM-E.

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Enumere 10 preguntas y respuestas comunes relacionadas con la aplicación de LE25CB643TT-TLM-E en soluciones técnicas

Sure! Here are 10 common questions and answers related to the application of LE25CB643TT-TLM-E in technical solutions:

  1. Question: What is LE25CB643TT-TLM-E?
    Answer: LE25CB643TT-TLM-E is a specific model of integrated circuit (IC) or microcontroller.

  2. Question: What is the purpose of LE25CB643TT-TLM-E?
    Answer: LE25CB643TT-TLM-E is designed to perform various functions in electronic devices, such as data processing, control, and communication.

  3. Question: What are the key features of LE25CB643TT-TLM-E?
    Answer: Some key features of LE25CB643TT-TLM-E include low power consumption, high-speed operation, embedded memory, and multiple I/O interfaces.

  4. Question: In which applications can LE25CB643TT-TLM-E be used?
    Answer: LE25CB643TT-TLM-E can be used in a wide range of applications, including consumer electronics, industrial automation, automotive systems, and IoT devices.

  5. Question: How can LE25CB643TT-TLM-E be programmed?
    Answer: LE25CB643TT-TLM-E can be programmed using specific software tools and programming languages, such as C or assembly language.

  6. Question: Can LE25CB643TT-TLM-E communicate with other devices?
    Answer: Yes, LE25CB643TT-TLM-E supports various communication protocols like SPI, I2C, UART, and CAN, allowing it to interact with other devices in a system.

  7. Question: What is the operating voltage range of LE25CB643TT-TLM-E?
    Answer: The operating voltage range of LE25CB643TT-TLM-E typically falls within 1.8V to 3.6V, but it's always recommended to refer to the datasheet for specific details.

  8. Question: Does LE25CB643TT-TLM-E have any built-in security features?
    Answer: Yes, LE25CB643TT-TLM-E may include built-in security features like encryption and authentication mechanisms to protect sensitive data.

  9. Question: Can LE25CB643TT-TLM-E be used in battery-powered devices?
    Answer: Yes, LE25CB643TT-TLM-E's low power consumption makes it suitable for battery-powered devices, helping to extend their battery life.

  10. Question: Where can I find more information about LE25CB643TT-TLM-E?
    Answer: You can find more detailed information about LE25CB643TT-TLM-E in its datasheet provided by the manufacturer or by contacting their technical support team.