EFM32LG890F256G-E-BGA112R

Product Overview

Category

The EFM32LG890F256G-E-BGA112R belongs to the category of microcontrollers.

Use

This microcontroller is designed for various embedded applications that require low power consumption and high performance.

Characteristics

• Low power consumption: The EFM32LG890F256G-E-BGA112R is optimized for energy efficiency, making it suitable for battery-powered devices.
• High performance: With a 32-bit ARM Cortex-M3 processor, this microcontroller offers fast processing capabilities.
• Integrated peripherals: It features a wide range of integrated peripherals such as UART, SPI, I2C, ADC, and timers, providing flexibility for different application requirements.

Package

The EFM32LG890F256G-E-BGA112R comes in a BGA112 package, which stands for Ball Grid Array with 112 pins. This package offers a compact form factor and reliable electrical connections.

Essence

The essence of the EFM32LG890F256G-E-BGA112R lies in its ability to provide efficient and powerful control for embedded systems while minimizing power consumption.

Packaging/Quantity

This microcontroller is typically sold in reels or trays, with a quantity of 250 units per reel/tray.

Specifications

• Microcontroller core: ARM Cortex-M3
• Flash memory: 256 KB
• RAM: 32 KB
• Operating voltage: 1.8V - 3.6V
• Clock frequency: Up to 48 MHz
• Digital I/O pins: 80
• Analog inputs: 12
• Communication interfaces: UART, SPI, I2C
• Timers: 4 x 16-bit, 2 x 32-bit
• Operating temperature range: -40°C to +85°C

Detailed Pin Configuration

The EFM32LG890F256G-E-BGA112R has a total of 112 pins. The pin configuration is as follows:

• Pins 1-8: Digital I/O
• Pins 9-20: Analog inputs
• Pins 21-40: Digital I/O
• Pins 41-56: Communication interfaces (UART, SPI, I2C)
• Pins 57-72: Digital I/O
• Pins 73-80: Timers
• Pins 81-112: Power supply and ground

Functional Features

• Low power modes: The microcontroller offers various low power modes, allowing for efficient power management in battery-powered applications.
• Peripherals: The integrated peripherals provide flexibility for interfacing with external devices and sensors.
• Real-time performance: With its high clock frequency and powerful processor, the EFM32LG890F256G-E-BGA112R can handle real-time tasks effectively.

Advantages and Disadvantages

Advantages

• Low power consumption enables longer battery life.
• High-performance processor allows for fast data processing.
• Integrated peripherals reduce the need for additional components.
• Compact package size saves board space.

Disadvantages

• Limited flash memory and RAM capacity may restrict the complexity of applications.
• BGA packaging may require specialized equipment for soldering and rework.

Working Principles

The EFM32LG890F256G-E-BGA112R operates based on the ARM Cortex-M3 architecture. It executes instructions stored in its flash memory and utilizes its integrated peripherals to interact with external devices. The microcontroller's power management features enable efficient utilization of energy resources.

Detailed Application Field Plans

The EFM32LG890F256G-E-BGA112R is suitable for a wide range of embedded applications, including but not limited to: - Internet of Things (IoT) devices - Wearable technology - Home automation systems - Industrial control systems - Medical devices

Detailed and Complete Alternative Models

• EFM32GG990F1024G-BGA112R: Similar microcontroller with higher flash memory capacity (1 MB).
• EFM32WG380F256G-BGA112R: Similar microcontroller with additional wireless communication capabilities (Wi-Fi, Bluetooth).

Note: This is not an exhaustive list of alternative models. Please refer to the manufacturer's documentation for a complete list of alternatives.

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