Optocoupler/LED/nixie tube/photoelectric device
onsemi (Ansemi)
Fabricantes
The H11FXM series consists of an AlGaAs infrared emitting diode coupled to a symmetrical bi-directional silicon photodetector. The detector is galvanically isolated from the input like an ideally isolated FET, suitable for distortion-free control of low-level AC and DC analog signals. The H11FXM series devices are installed in a two-wire in-capsulation.
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HONGLITRONIC (Hongli Optoelectronics)
Fabricantes
0805 green light 0805 emerald green LED patch Material: gold plate + gold wire
Descripción
EVERLIGHT (ever light)
Fabricantes
Nationstar Optoelectronics
Fabricantes
Huawei verifies the materials. Luminous color: 0805 red; 2012 red; Dominant wavelength: 633nm Peak wavelength: 640nm Test current: 20mA Forward voltage (VF): 2V Luminous intensity: 70mcd Power: 65mW Beaming angle: 140° Working temperature: -30℃~+85 ℃
Descripción
NEWOPTO (Xin Yongcheng Optoelectronics)
Fabricantes
Photosensitive diode receiving infrared photosensitive triode strong anti-interference size 5*8.6Typ.940nm700-1100nmmin.35V (BR)Typ.400μAMax.0.1μA
Descripción
onsemi (Ansemi)
Fabricantes
The FOD0721/0720/0710 series uses Optoplanar, Fairchild's proprietary coplanar encapsulation technology, and optimizes the IC design to guarantee a minimum common-mode noise rejection (CMR) rating of 20kV/μs.
Descripción
NEWOPTO (Xin Yongcheng Optoelectronics)
Fabricantes
∮3plug-in940 infrared lamp ∮3plug-in940 emission tube size 3*5.3 current 40mATyp.1.45VTyp.850nm
Descripción
colorful screen
Descripción
EVERLIGHT (ever light)
Fabricantes
Broadcom/AVAGO (Avago)
Fabricantes
EVERLIGHT (ever light)
Fabricantes
ekinglux (Ekinglux)
Fabricantes
Baizou (Baizhou)
Fabricantes
onsemi (Ansemi)
Fabricantes
The FOD8160 is a 3.3V/5V high-speed logic gate output (open collector output) optocoupler that supports isolated communication, allowing digital signals to communicate between systems without conducting ground loops or hazardous voltages. The device uses Fairchild's proprietary Optoplanar coplanar encapsulation technology to optimize IC design and achieve high noise immunity through high common-mode rejection specifications.
Descripción